Low heatsinks for better chassis clearance

4 heatpipes with Direct Contact Technology creates a sleek contact surface area for maximize heat dissipation.

Positioned in a 45-degree angle and surrounding the heatpipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most – next to the heatpipes

Newly Optimized blade design with updated curve that provides best balance between airflow and static pressure to take the heat away while remain extremely silence.

QUIET OPERATION

PRODUCT NUMBER

RR-2V2E-18PK-R1

EXTERIOR COLOR

SILVER, BLACK

CPU SOCKET

LGA2066, LGA2011-V3, LGA2011, LGA1200, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150, LGA775, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1

DIMENSIONS (L X W X H)

120 X 80 X 154 MM / 4.7 X 3.1 X 6.1 INCH

HEAT SINK MATERIAL

4 HEAT PIPES, DIRECT CONTACT, ALUMINUM FINS

FAN DIMENSIONS (L X W X H)

120 X 120 X 25 MM / 4.7 X 4.7 X 1 INCH

FAN QUANTITY

1 PCS

FAN SPEED

650-1800 RPM (PWM) ± 5%

FAN AIRFLOW

62 CFM (MAX)

FAN NOISE LEVEL

8 – 27 DBA

FAN AIR PRESSURE

2.5 MMH2O (MAX)

FAN MTTF

160,000 HOURS

FAN POWER CONNECTOR

4-PIN (PWM)

FAN RATED VOLTAGE

12VDC

FAN RATED CURRENT

0.15A

FAN SAFETY CURRENT

0.37A

FAN POWER CONSUMPTION

1.8W

COOLER TYPE

AIR COOLER

SERIES

HYPER

HEATPIPES

4

NOTE *LGA1700 MOUNTING KIT INCLUDED IN PRODUCTS WITH NEW PACKAGING DESIGN. YOU MAY OBTAIN REQUIRED MOUNTING KITS FOR PRODUCTS WITH OLDER PACKAGE DESIGN THROUGH CM STORE OR REGIONAL RESELLERS AND DISTRIBUTORS.